Institutional / investor-grade, scalable BOM model (COGS-focused).
All values below are parametric targets (not quotes). They’re intended to be used as a baseline cost stack for your financial simulator and refined with supplier RFQs.

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1) Cost Structure Template (Used for All Models)

COGS per unit =

1. Materials & parts (BOM)
2. Direct labor (assembly + test)
3. Factory overhead (line, tools, utilities, yield loss)
4. Warranty reserve (field failure allowance)
5. Logistics & packaging

To keep comparability, every model is decomposed into the same subsystems:

A. Chassis & structural frame (spine + rings + limb bones)
B. Actuation & joints (ACUs / EAP drivers)
C. Compute stack (NSC cartridges)
D. Hexagon lattice stack (HNL tiles/cassettes)
E. Sensors & perception hardware
F. Power system (battery, BMS/PMU, busbars)
G. Thermal system (air or liquid)
H. Skin & external panels (incl. tactile mesh when present)
I. Harnessing & connectors (power/data/safety)
J. Assembly, calibration, QA test, yield
K. Packaging, shipping, compliance labeling
L. Warranty reserve

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2) Manufacturing Readiness Assumptions (Three Production Bands)

Because costs depend massively on volume and maturity, use three bands:

Band P (Pilot) — 10–50 units/year

• Higher unit labor, low supplier discounts, more scrap/yield loss.

Band L (Low-rate) — 100–300 units/year

• Partial automation, better pricing, stable processes.

Band S (Serial) — 1,000+ units/year

• Tooling amortized, strong supplier pricing, line efficiency.

I’ll give you Band L as the main baseline, plus multipliers to convert to Pilot or Serial.

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3) Model Definitions (What Each Includes)

• ZT-1 (Research Core): rugged chassis, basic actuation, limited sensors, NSC compute only, no full HNL (or minimal tile set), limited skin.
• ZT-3 (Industrial Pilot): stronger actuation, expanded sensors, NSC + partial HNL, basic tactile optional.
• ZT-7 (Adaptive Industrial): full closed-loop embodiment, NSC + full HNL, redundancy in power/thermal, higher reliability.
• ZT-10 (Full Series Flagship): max compute + HNL density, full tactile skin, best thermal, highest redundancy + audit/security module package.

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4) Baseline COGS Tables (Band L)

4.1 ZT-1 — Cost Stack (Band L)

Target COGS: $45k – $65k

Subsystem	Cost Range
A. Chassis & structural	$6k – $9k
B. Actuation & joints	$12k – $18k
C. NSC compute	$6k – $10k
D. HNL lattice	$0.5k – $2k (minimal)
E. Sensors	$2k – $4k
F. Power system	$4k – $7k
G. Thermal	$1k – $2.5k
H. Skin/panels	$1k – $2.5k
I. Harness/connectors	$1.5k – $3k
J. Assembly + QA	$6k – $10k
K. Pack/ship	$0.8k – $1.5k
L. Warranty reserve	$1k – $2k

Use case pricing logic: labs pay for platform access + upgrade path (low HNL density keeps unit cost down).

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4.2 ZT-3 — Cost Stack (Band L)

Target COGS: $70k – $100k

Subsystem	Cost Range
A. Chassis & structural	$8k – $12k
B. Actuation & joints	$18k – $28k
C. NSC compute	$10k – $18k
D. HNL lattice	$6k – $14k (partial)
E. Sensors	$5k – $10k
F. Power system	$6k – $10k
G. Thermal	$2k – $5k
H. Skin/panels	$2k – $5k
I. Harness/connectors	$2.5k – $4.5k
J. Assembly + QA	$10k – $16k
K. Pack/ship	$1k – $2k
L. Warranty reserve	$2k – $4k

Core driver: actuation + compute + partial lattice.

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4.3 ZT-7 — Cost Stack (Band L)

Target COGS: $110k – $160k

Subsystem	Cost Range
A. Chassis & structural	$10k – $16k
B. Actuation & joints	$26k – $40k
C. NSC compute	$18k – $30k
D. HNL lattice	$18k – $35k (full)
E. Sensors	$10k – $18k
F. Power system	$10k – $18k (redundancy)
G. Thermal	$5k – $10k (liquid option)
H. Skin/tactile	$6k – $12k
I. Harness/connectors	$4k – $7k
J. Assembly + QA	$12k – $20k
K. Pack/ship	$1.2k – $2.5k
L. Warranty reserve	$4k – $7k

Core driver: full lattice + reliability + thermal.

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4.4 ZT-10 — Cost Stack (Band L)

Target COGS: $160k – $240k

Subsystem	Cost Range
A. Chassis & structural	$12k – $20k
B. Actuation & joints	$35k – $55k
C. NSC compute	$28k – $45k
D. HNL lattice	$35k – $70k (max density)
E. Sensors	$18k – $35k (full suite)
F. Power system	$14k – $28k (dual packs + bus)
G. Thermal	$8k – $16k (full liquid)
H. Skin/tactile	$12k – $25k (full body)
I. Harness/connectors	$6k – $10k
J. Assembly + QA	$18k – $30k
K. Pack/ship	$1.5k – $3k
L. Warranty reserve	$6k – $12k

Core driver: max compute + HNL + sensors + tactile skin + redundancy.

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5) Volume Multipliers (Convert Band L → Pilot or Serial)

Apply these multipliers to the Band L totals:

• Pilot (Band P): × 1.25 to 1.60
  (labor inefficiency + yield loss + no supplier discounts)
• Serial (Band S): × 0.65 to 0.80
  (tooling amortized + discounts + process maturity)

Example: ZT-7 at $140k Band L

• Pilot: $175k–$224k
• Serial: $91k–$112k

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6) What Drives Cost (Pareto by Model)

ZT-1 Pareto

1. Actuation/joints
2. Assembly + QA
3. Compute

ZT-3 Pareto

1. Actuation/joints
2. Compute
3. Partial HNL + sensors

ZT-7 Pareto

1. HNL + compute (combined)
2. Actuation
3. Sensors + thermal redundancy

ZT-10 Pareto

1. HNL
2. Compute
3. Sensors + tactile skin
4. Actuation + thermal

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7) Cost Reduction Roadmap (Engineering Levers)

Highest ROI levers:

• Standardize actuator cartridges (ACU) across joints (reduce unique SKUs)
• Standardize compute cassettes (C-Tile / H-Tile) and backplane
• Shift to molded composite panels + metal inserts (skin + structure)
• Automate calibration rigs (reduce labor + increase yield)
• Reduce connector variety (3 classes only: D/P/S)
• Use common harness corridors and lengths (pre-made looms)

Target reduction potential (Band L → Band S):

• Actuation: 15–30%
• Compute/HNL: 20–40% (supplier + integration)
• Assembly: 30–50% (fixtures + procedure + automation)

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8) Spreadsheet-Ready Parameters (for your simulator)

For each model i:

• Units/year $U_i$Ui​
• BOM subtotal $BOM_i$BOMi​
• Labor hours $H_i$Hi​, labor rate $R$R
• Overhead rate $OH\%$OH%
• Warranty $W\%$W%
• Logistics $L_i$Li​

COGS formula:$$COGS_i = BOM_i + (H_i \cdot R) + OH\% \cdot (BOM_i + H_iR) + W\% \cdot SP_i + L_i$$COGSi​=BOMi​+(Hi​⋅R)+OH%⋅(BOMi​+Hi​R)+W%⋅SPi​+Li​

(If you prefer, warranty can be % of COGS instead of price.)